Process based cost modeling of emerging optoelectronic interconnects: implications for material platform choice

TitleProcess based cost modeling of emerging optoelectronic interconnects: implications for material platform choice
Publication TypeThesis
Year of Publication2008
AuthorsLiu S
Academic DepartmentTechnology & Policy Program
DegreeS.M.
UniversityMIT
URLhttp://hdl.handle.net/1721.1/43182

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